“EMVCo is to launch an initiative to evaluate the role of wireless technologies not yet covered in its specifications — including Wi-Fi, ultra wideband (UWB), Bluetooth Low Energy (BLE) and mobile data — in creating “flexible and convenient payment experiences”, the technical body’s annual report reveals.”

“EMVCo has issued a new specification bulletin that adds support for elliptic curve cryptography (ECC) to its EMV contact chip specifications to enable ‘robust EMV contact chip security long term as payment technologies evolve.'”

“Global technical body EMVCo has published new resources to help card issuers and merchants to optimise the EMV® 3-D Secure (EMV 3DS) authentication experience for online shoppers when EMV Payment Tokens are in use, enhancing the fraud-prevention benefits that EMV 3DS provides. EMV Payment Tokens are used across the payments ecosystem to increase the security of card-based transactions by replacing the primary account number (PAN) with a unique alternative value. Industry feedback identified an opportunity to improve the EMV 3DS authentication process by making Payment Tokens and related data available as part of the 3DS Authentication Request to improve issuer decision making and the consumer experience.”

“EMV® contactless payment terminal requirements have been updated by global technical body EMVCo to help enable a more reliable and consistent payment experience through the addition of IQ demodulation requirements. The development reflects consumer use of an increasing range of card technologies, self-powered payment devices such as smartphones, and wearables to perform transactions. Mass transit could be one sector to benefit from the enhancements provided by IQ demodulation with faster turnstile throughput, and greater flexibility in where the payment device is positioned to authorise entry into a transport network.”